MC1488
Quad Line EIA-232D Driver
The MC1488 is a monolithic quad line driver designed to interface
data terminal equipment with data communications equipment in
conformance with the specifications of EIA Standard No. EIA−232D.
Features

http://onsemi.com

• Current Limited Output
±10 mA typical

• Power−Off Source Impedance
•
•
•
•

300 W minimum
Simple Slew Rate Control with External Capacitor
Flexible Operating Supply Range
Compatible with All ON Semiconductor DTL and TTL Logic
Families
Pb−Free Packages are Available

SOIC−14
D SUFFIX
CASE 751A

14
1

PDIP−14
P SUFFIX
CASE 646

14
1

SOEIAJ−14
M SUFFIX
CASE 965

14

1

PIN CONNECTIONS

Line Driver
MC1488

Interconnecting
Cable

DTL Logic Input

Interconnecting
Cable

VEE 1

Line Receiver
MC1489

DTL Logic Output

14 VCC

Input A 2

13 Input D1

Output A 3

12 Input D2

Input B1 4

11 Output D

Input B2 5

10 Input C1

Output B 6

9 Input C2

Gnd 7

8 Output C

Figure 1. Simplified Application
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.

DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.

© Semiconductor Components Industries, LLC, 2009

December, 2009 − Rev. 9

1

Publication Order Number:
MC1488/D

MC1488
VCC 14
6.2 k

8.2 k
Pins 4, 9, 12 or 2
Input
Input
Pins 5, 10, 13

70
300
Output
Pins 6, 8, 11 or 3

3.6 k

GND 7

10 k
7.0 k
VEE 1

Figure 2. Circuit Schematic
(1/4 of Circuit Shown)

http://onsemi.com
2

70

MC1488
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.)
Symbol

Value

Unit

Power Supply Voltage

VCC
VEE

+ 15
− 15

Vdc

Input Voltage Range

VIR

− 15 p VIR p
7.0

Vdc

Output Signal Voltage

VO

±15

Vdc

PD
1/RqJA

1000
6.7

mW
mW/°C

Rating

Power Derating (Package Limitation, SO−14 and Plastic Dual−In−Line Package)
Derate above TA = + 25°C
Operating Ambient Temperature Range

TA

0 to + 75

°C

Storage Temperature Range

Tstg

− 65 to + 175

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

ELECTRICAL CHARACTERISTICS (VCC = + 9.0 ± 1% Vdc, VEE = −9.0 ± 1% Vdc, TA = 0 to 75°C, unless otherwise noted.)
Symbol

Min

Typ

Max

Unit

Input Current − Low Logic State (VIL = 0)

IIL

−

1.0

1.6

mA

Input Current − High Logic State (VIH = 5.0 V)

IIH

−

−

10

mA

+ 6.0
+ 9.0

+7.0
+10.5

−
−

− 6.0
− 9.0

− 7.0
− 10.5

−
−

Characteristic

Output Voltage − High Logic State
(VIL = 0.8 Vdc, RL = 3.0 kW , VCC = + 9.0 Vdc, VEE = − 9.0 Vdc)
(VIL = 0.8 Vdc, RL = 3.0 kW , VCC = + 13.2 Vdc, VEE = − 13.2 Vdc)

VOH

Output Voltage − Low Logic State
(VIH = 1.9 Vdc, RL = 3.0 kW , VCC = + 9.0 Vdc, VEE = − 9.0 Vdc)
(VIH = 1.9 Vdc, RL = 3.0 kW , VCC = + 13.2 Vdc, VEE = − 13.2 Vdc)

VOL

Positive Output Short−Circuit Current, Note 1

IOS+

+ 6.0

+ 10

+ 12

mA

Negative Output Short−Circuit Current, Note 1

IOS−

− 6.0

− 10

− 12

mA

ro

300

−

−

Ohms

−
−
−
−
−
−

+ 15
+ 4.5
+ 19
+ 5.5
−
−

+ 20
+ 6.0
+ 25
+ 7.0
+ 34
+ 12

−
−
−
−
−
−

− 13
−
− 18
−
−
−

− 17
− 500
− 23
− 500
− 34
− 2.5

−
−

−
−

333
576

Output Resistance (VCC = VEE = 0, ⎥ VO ⎜ = ± 2.0 V)
Positive Supply Current (RI = ∞)
(VIH = 1.9 Vdc, VCC = + 9.0 Vdc)
(VIL = 0.8 Vdc, VCC = + 9.0 Vdc)
(VIH = 1.9 Vdc, VCC = + 12 Vdc)
(VIL = 0.8 Vdc, VCC = + 12 Vdc)
(VIH = 1.9 Vdc, VCC = + 15 Vdc)
(VIL = 0.8 Vdc, VCC = + 15 Vdc)

ICC

Negative Supply Current (RL = ∞)
(VIH = 1.9 Vdc, VEE = − 9.0 Vdc)
(VIL = 0.8 Vdc, VEE = − 9.0 Vdc)
(VIH = 1.9 Vdc, VEE = − 12 Vdc)
(VIL = 0.8 Vdc, VEE = − 12 Vdc)
(VIH = 1.9 Vdc, VEE = − 15 Vdc)
(VIL = 0.8 Vdc, VEE = − 15 Vdc)

IEE

Power Consumption
(VCC = 9.0 Vdc, VEE = − 9.0 Vdc)
(VCC = 12 Vdc, VEE = − 12 Vdc)

PC

Vdc

Vdc

mA

mA
mA
mA
mA
mA
mA
mW

SWITCHING CHARACTERISTICS (VCC = +9.0 ± 1% Vdc, VEE = −9.0 ± 1% Vdc, TA = +25°C.)
Propagation Delay Time (zI = 3.0 k and 15 pF)

tPLH

−

275

350

ns

Fall Time

(zI = 3.0 k and 15 pF)

tTHL

−

45

75

ns

Propagation Delay Time (zI = 3.0 k and 15 pF)

tPHL

−

110

175

ns

Rise Time

tTLH

−

55

100

ns

(zI = 3.0 k and 15 pF)

1. Maximum Package Power Dissipation may be exceeded if all outputs are shorted simultaneously.

http://onsemi.com
3

MC1488
CHARACTERISTIC DEFINITIONS
9.0 V

-9.0 V

14

9.0 V

1

14

1.9 V
5

2

1

2

3

4

6

9

8

12

11

VOL

10

4

-9.0 V

9

VOH

3.0 k

13
12
0.8 V

VOH

7

7

VOL
IIL
IIH
5.0 V

Figure 3. Input Voltage

VCC

Figure 4. Output Current

VEE
14

14

1.9 V

7

1

1
2

IOS+

2

3

4

6

9

8

3
6

5

IOS±

8
9

IOS-

± 6.6 mA Max

11

10
12

VO
± 2.0 Vdc

4

11

12

13

7

0.8 V

Figure 5. Output Short−Circuit Current

Figure 6. Output Resistance (Power Off)

VCC
ein

VO

ICC

1.9 V
2
VIH

3.0 k

14

4

3.0 V
7

1.5 V

9
VIL

ein
12

0V

tPHL

1

tPLH

VO
0.8 V

15 pF

50%

IEE

tTHL

tTLH
tTHL and tTLH Measured 10% to 90%

VEE

Figure 7. Power Supply Currents

Figure 8. Switching Response

http://onsemi.com
4

MC1488

12

VCC = VEE = ± 12 V

9.0
V O , OUTPUT VOLTAGE (V)

I SC , SHORT CIRCUIT OUTPUT CURRENT (mA)

TYPICAL CHARACTERISTICS
(TA = +25°C, unless otherwise noted.)

VCC = VEE = ± 9.0 V

6.0

VCC = VEE = ± 6.0 V

3.0
VI

0

VO

-3.0

3.0 k

-6.0
-9.0
-12
0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

12
9.0

IOS+

6.0
VCC = 9.0 V

1.9 V

3.0

VI

0
-3.0

0.8 V

VEE = 9.0 V

-6.0
IOS-

-9.0
-12
-55

0

25

75

125

Vin, INPUT VOLTAGE (V)

T, TEMPERATURE (°C)

Figure 9. Transfer Characteristics
versus Power Supply Voltage

Figure 10. Short Circuit Output Current
versus Temperature

20

1000
IO , OUTPUT CURRENT (mA)

100

10

VI

VO
CL

1.0
1.0

10

100

1,000

10,000

12
3.0 kW LOAD LINE

8.0
4.0
0
-4.0
-8.0

1.9 V

-12

IOS

VI

+
VO
-16 0.8 V VCC = VEE = ± 9.0V -20
-16
-12
-8.0
-4.0
0
4.0

8.0

CL, CAPACITANCE (pF)

VO, OUTPUT VOLTAGE (V)

Figure 11. Output Slew Rate
versus Load Capacitance

Figure 12. Output Voltage and
Current−Limiting Characteristics

VCC, VEE, POWER SUPPLY VOLTAGE (V)

SLEW RATE (V/s)
μ

16

16
14

VCC
14

12

3 3.0 k

10

6 3.0 k

8.0

8 3.0 k

6.0

11 3.0 k

4.0
7

2.0
0
-55

1
VEE
0

25

75

T, TEMPERATURE (°C)

Figure 13. Maximum Operating Temperature
versus Power Supply Voltage

http://onsemi.com
5

125

12

16

MC1488
APPLICATIONS INFORMATION
The Electronic Industries Association EIA−232D
specification details the requirements for the interface
between data processing equipment and data
communications equipment. This standard specifies not
only the number and type of interface leads, but also the
voltage levels to be used. The MC1488 quad driver and its
companion circuit, the MC1489 quad receiver, provide a
complete interface system between DTL or TTL logic levels
and the EIA−232D defined levels. The EIA−232D
requirements as applied to drivers are discussed herein.
The required driver voltages are defined as between
5.0 and 15 V in magnitude and are positive for a Logic “0”
and negative for a Logic “1.” These voltages are so defined
when the drivers are terminated with a 3000 to 7000 W
resistor. The MC1488 meets this voltage requirement by
converting a DTL/TTL logic level into EIA−232D levels
with one stage of inversion.
The EIA−232D specification further requires that
during transitions, the driver output slew rate must not
exceed 30 V per microsecond. The inherent slew rate of the
MC1488 is much too fast for this requirement. The current
limited output of the device can be used to control this slew
rate by connecting a capacitor to each driver output. The
required capacitor can be easily determined by using the
relationship C = IOS x DT/DV from which Figure 14 is
derived. Accordingly, a 330 pF capacitor on each output
will guarantee a worst case slew rate of 30 V per
microsecond.

power supply designs, a loss of system power causes a low
impedance on the power supply outputs. When this occurs,
a low impedance to ground would exist at the power inputs
to the MC1488 effectively shorting the 300 W output
resistors to ground. If all four outputs were then shorted to
plus or minus 15 V, the power dissipation in these resistors
would be excessive. Therefore, if the system is designed to
permit low impedances to ground at the power supplies of
the drivers, a diode should be placed in each power supply
lead to prevent overheating in this fault condition. These two
diodes, as shown in Figure 15, could be used to decouple all
the driver packages in a system. (These same diodes will
allow the MC1488 to withstand momentary shorts to the
±25 V limits specified in the earlier Standard EIA−232B.)
The addition of the diodes also permits the MC1488 to
withstand faults with power supplies of less than the 9.0 V
stated above.
VCC

14

14

14

MC1488

MC1488

MC1488

1000

SLEW RATE (V/s)
μ

7

100

1

7

1

7

1

VEE

30 V/ms

Figure 15. Power Supply Protection
to Meet Power Off Fault Conditions
10

The maximum short circuit current allowable under
fault conditions is more than guaranteed by the previously
mentioned 10 mA output current limiting.

333 pF
1.0
1.0

10

100

1,000

Other Applications

10,000

The MC1488 is an extremely versatile line driver with
a myriad of possible applications. Several features of the
drivers enhance this versatility:
1. Output Current Limiting − this enables the circuit
designer to define the output voltage levels independent of
power supplies and can be accomplished by diode
clamping of the output pins. Figure 16 shows the MC1488
used as a DTL to MOS translator where the high level
voltage output is clamped one diode above ground. The
resistor divider shown is used to reduce the output voltage
below the 300 mV above ground MOS input level limit.

C, CAPACITANCE (pF)

Figure 14. Slew Rate versus Capacitance
for ISC = 10 mA

The interface driver is also required to withstand an
accidental short to any other conductor in an
interconnecting cable. The worst possible signal on any
conductor would be another driver using a plus or minus
15 V, 500 mA source. The MC1488 is designed to
indefinitely withstand such a short to all four outputs in a
package as long as the power supply voltages are greater
than 9.0 V (i.e., VCC q 9.0 V; VEE p − 9.0 V). In some

http://onsemi.com
6

MC1488
MC1488 will drive the output to within 2.0 V of the positive
or negative supplies as long as the current output limits are not
exceeded. The combination of the current limiting and supply
voltage features allow a wide combination of possible outputs
within the same quad package. Thus if only a portion of the
four drivers are used for driving EIA−232D lines, the
remainder could be used for DTL to MOS or even DTL to
DTL translation. Figure 17 shows one such combination.

2. Power Supply Range − as can be seen from the
schematic drawing of the drivers, the positive and negative
driving elements of the device are essentially independent
and do not require matching power supplies. In fact, the
positive supply can vary from a minimum 7.0 V (required for
driving the negative pulldown section) to the maximum
specified 15 V. The negative supply can vary from
approximately − 2.5 V to the minimum specified − 15 V. The

12 V

1/4 MC1488
DTL
TTL
Input

MOS Output
(with VSS = GND)

1.0 k
10 k

-12 V

DTL
Input

2

DTL
NAND
Gate
Input

4

DTL
HTL
Input

-12 V
DTL
MMOS
Input

Figure 16. DTL/TTL−to−MOS Translator

3

5
9

RTL Output
-0.7 V to +3.7 V

6

3.0 V

8

5.0 V

DTL Output
-0.7 V to +5.7 V

MC1488
HTL Output
-0.7 V to 10 V

10
12
11

MOS Output
-10 V to 0 V

1.0 k

13

10 k
1

-12 V

7

14

12 V

Figure 17. Logic Translator Applications

http://onsemi.com
7

MC1488
ORDERING INFORMATION
Device

Package

MC1488D

SOIC−14

MC1488DG

SOIC−14
(Pb−Free)

MC1488DR2

SOIC−14

MC1488DR2G

SOIC−14
(Pb−Free)

MC1488P

PDIP−14

MC1488PG

PDIP−14
(Pb−Free)

Operating Temperature Range

55 Units/Rail

2500/Tape & Reel

TA = 0 to +75°C

MC1488M

SOEIAJ−14

MC1488MG

SOEIAJ−14
(Pb−Free)

MC1488MEL

SOEIAJ−14

MC1488MELG

SOEIAJ−14
(Pb−Free)

25 Units/Rail

50 Units/Rail

2000/Tape & Reel

MARKING DIAGRAMS

SOIC−14
D SUFFIX
CASE 751A
14

1

PDIP−14
P SUFFIX
CASE 646

14
MC1488G
AWLYWW

Shipping

14
MC1488DG
AWLYWW

MC1488P
AWLYYWWG
1

1

SOEIAJ−14
M SUFFIX
CASE 965

MC1488
ALYWG

A
WL, L
YY, Y
WW, W
G

= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package

http://onsemi.com
8

MC1488
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.

−A−
14

8

−B−

P 7 PL
0.25 (0.010)

M

7

1

G

−T−
0.25 (0.010)

M

T B

S

A

DIM
A
B
C
D
F
G
J
K
M
P
R

J

M

K

D 14 PL

F

R X 45 _

C

SEATING
PLANE

B

M

S

SOLDERING FOOTPRINT*
7X

7.04

14X

1.52
1
14X

0.58

1.27
PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
9

MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50

INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019

MC1488
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P

14

8

1

7

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.

B

A
F

L

N

C

−T−
SEATING
PLANE

H

G

D 14 PL

J

K

0.13 (0.005)

M
M

http://onsemi.com
10

DIM
A
B
C
D
F
G
H
J
K
L
M
N

INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039

MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01

MC1488
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A

14

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).

LE

8

Q1
E HE

M_
L

7

1

DETAIL P

Z
D
VIEW P

A

e

A1

b
0.13 (0.005)

c

M

0.10 (0.004)

DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z

MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42

INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056

ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com

N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850

http://onsemi.com
11

ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

MC1488/D