Dual Bootstrapped, 12 V MOSFET
Driver with Output Disable
ADP3418
FEATURES

GENERAL DESCRIPTION

All-in-one synchronous buck driver
Bootstrapped high-side drive
1 PWM signal generates both drives
Anticross-conduction protection circuitry
Output disable control turns off both MOSFETs to float the
output per Intel® VR 10 and AMD Opteron™ specifications

The ADP3418 is a dual, high voltage MOSFET driver optimized
for driving two N-channel MOSFETs, the two switches in a
nonisolated, synchronous, buck power converter. Each of the
drivers is capable of driving a 3000 pF load with a 30 ns
transition time. One of the drivers can be bootstrapped and is
designed to handle the high voltage slew rate associated with
floating high-side gate drivers. The ADP3418 includes
overlapping drive protection to prevent shoot-through current
in the external MOSFETs. The OD pin shuts off both the highside and the low-side MOSFETs to prevent rapid output
capacitor discharge during system shutdowns.

APPLICATIONS
Multiphase desktop CPU supplies
Single-supply synchronous buck converters

The ADP3418 is specified over the commercial temperature
range of 0°C to 85°C and is available in an 8-lead SOIC package.

FUNCTIONAL BLOCK DIAGRAM
12V

CVCC

D1
VCC
4

ADP3418
1

IN 2
8

CBST2

BST
DRVH

CBST1
Q1
RG

DELAY

7

CMP

Q

R

Q

SW

VCC
6

DELAY
5

CMP

6

1V

3

OD

DRVL

Q2

PGND

03229-B-001

S

TO
INDUCTOR

RBST1

Figure 1.

©2010 SCILLC. All rights reserved.
May 2010 – Rev. 6

Publication Order Number:
ADP3418/D

ADP3418
TABLE OF CONTENTS
Features .............................................................................................. 1

High-Side Driver ...........................................................................9

Applications ....................................................................................... 1

Overlap Protection Circuit...........................................................9

General Description ......................................................................... 1

Application Information ................................................................ 10

Functional Block Diagram .............................................................. 1

Supply Capacitor Selection ....................................................... 10

Specifications..................................................................................... 3

Bootstrap Circuit ........................................................................ 10

Absolute Maximum Ratings............................................................ 4

MOSFET Selection ..................................................................... 10

ESD Caution .................................................................................. 4

High-Side (Control) MOSFETs ................................................ 10

Pin Configuration and Function Descriptions ............................. 5

Low-Side (Synchronous) MOSFETs .........................................11

Timing Characteristics..................................................................... 6

PC Board Layout Considerations..............................................11

Typical Performance Characteristics ............................................. 7

Outline Dimensions ....................................................................... 13

Theory of Operation ........................................................................ 9

Ordering Guide .......................................................................... 13

Low-Side Driver............................................................................ 9

Rev. 6 | Page 2 of 13 | www.onsemi.com

ADP3418
SPECIFICATIONS1
VCC = 12 V, BST = 4 V to 26 V, TA = 0°C to 85°C, unless otherwise noted.
Table 1.
Parameter
SUPPLY
Supply Voltage Range
Supply Current
OD INPUT
Input Voltage High
Input Voltage Low
Input Current
Propagation Delay Time
PWM INPUT
Input Voltage High
Input Voltage Low
Input Current
HIGH-SIDE DRIVER
Output Resistance, Sourcing Current
Output Resistance, Sinking Current
Transition Times
Propagation Delay2
LOW-SIDE DRIVER
Output Resistance, Sourcing Current
Output Resistance, Sinking Current
Transition Times
Propagation Delay2
Timeout Delay

1
2

Symbol

Conditions

VCC
ISYS

BST = 12 V, IN = 0 V

Min

Typ

Max

Unit

3

13.2
6

V
mA
V
V
µA
ns

4.15

2.6

tpdhOD

See Figure 3

25

0.8
+1
40

tpdlOD

See Figure 3

20

40

ns

0.8
+1

V
V
µA

1.8
1.0
35
20
40
20

3.0
2.5
45
30
65
35

Ω
Ω
ns
ns
ns
ns

1.8
1.0
25
21
30
10
240
120

3.0
2.5
35
30
60
20

Ω
Ω
ns
ns
ns
ns
ns
ns

−1

3.0
−1

trDRVH
tfDRVH
tpdhDRVH
tpdlDRVH

trDRVL
tfDRVL
tpdhDRVL
tpdlDRVL

VBST − VSW = 12 V
VBST − VSW = 12 V
See Figure 4, VBST − VSW = 12 V, CLOAD = 3 nF
See Figure 4, VBST − VSW = 12 V, CLOAD = 3 nF
See Figure 4, VBST − VSW = 12 V
VBST − VSW = 12 V

See Figure 4, CLOAD = 3 nF
See Figure 4, CLOAD = 3 nF
See Figure 4
See Figure 4
SW = 5 V
SW = PGND

All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
For propagation delays, tpdh refers to the specified signal going high, and tpdl refers to it going low.

Rev. 6 | Page 3 of 13 | www.onsemi.com

10

5

90

ADP3418
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VCC
BST
DC
<200 ns
BST to SW
SW
DC
<200 ns
DRVH (DC)
DRVH (<200 ns)
DRVL (DC)
DRVL (<200 ns)
IN, OD
Operating Ambient
Temperature Range
Operating Junction
Temperature Range
Storage Temperature Range
Junction-to-Air Thermal Resistance (θJA)
2-Layer Board
4-Layer Board
Lead Temperature (Soldering, 10 sec)
Infrared (15 sec)

Rating
−0.3 V to +15 V
−0.3 V to VCC + 15 V
−0.3 V to +36 V
−0.3 V to +15 V
−5 V to +15 V
−10 V to +25 V
SW − 0.3 V to BST + 0.3 V
SW − 2 V to BST + 0.3 V
−0.3 V to VCC + 0.3 V
−2 V to VCC + 0.3 V
−0.3 V to +6.5 V

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to PGND.

0°C to 85°C
0°C to 150°C
−65°C to +150°C
123°C/W
90°C/W
300°C
260°C

ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.

Rev. 6 | Page 4 of 13 | www.onsemi.com

ADP3418
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
IN 2

8

AD3418

DRVH

SW
TOP VIEW
OD 3 (Not to Scale) 6 PGND
VCC 4
5 DRVL
7

03229-B-002

BST 1

Figure 2. Pin Configuration

Table 3. Pin Function Descriptions
Pin No.
1

Mnemonic
BST

2
3

IN
OD

4
5
6
7

VCC
DRVL
PGND
SW

8

DRVH

Description
Upper MOSFET Floating Bootstrap Supply. A capacitor connected between the BST and SW pins holds this
bootstrapped voltage for the high-side MOSFET as it is switched. The capacitor should be between 100 nF and 1 µF.
Logic Level Input. This pin has primary control of the drive outputs.
Output Disable. When low, this pin disables normal operation, forcing DRVH and DRVL low.
Input Supply. This pin should be bypassed to PGND with a ~1 µF ceramic capacitor.
Synchronous Rectifier Drive. Output drive for the lower (synchronous rectifier) MOSFET.
Power Ground. Should be closely connected to the source of the lower MOSFET.
This pin is connected to the buck switching node, close to the upper MOSFET’s source. It is the floating return
for the upper MOSFET drive signal.
Buck Drive. Output drive for the upper (buck) MOSFET.

Rev. 6 | Page 5 of 13 | www.onsemi.com

ADP3418
TIMING CHARACTERISTICS

OD

tpdlOD

tpdhOD

03229-B-003

90%
DRVH
OR DRVL

10%

Figure 3. Output Disable Timing Diagram

IN

tpdlDRVL tfDRVL

trDRVL

tpdlDRVH

DRVL

tfDRVH
tpdhDRVH trDRVH

VTH

VTH

tpdhDRVL
SW

1V

Figure 4. Timing Diagram—Timing Is Referenced to the 90% and 10% Points, Unless Otherwise Noted

Rev. 6 | Page 6 of 13 | www.onsemi.com

03229-B-004

DRVH-SW

ADP3418
TYPICAL PERFORMANCE CHARACTERISTICS
26
VCC = 12V
CLOAD = 3nF
IN

24

1

FALL TIME (ns)

DRVL

DRVH
2

DRVL

22

DRVH

20

3
03229-B-005

16
0

25

50
75
100
JUNCTION TEMPERATURE (°C)

125

03229-B-008

18

Figure 8. DRVH and DRVL Fall Times vs. Junction Temperature

Figure 5. DRVH Rise and DRVL Fall Times

60
TA = 25°C
VCC = 12V

IN

DRVH

50

RISE TIME (ns)

1
DRVH

2

40
DRVL
30

20

5

03229-B-006

10
1

Figure 6. DRVH Fall and DRVL Rise Times

40

5

03229-B-009

3

03229-B-010

DRVL

2

3
LOAD CAPACITANCE (nF)

4

Figure 9. DRVH and DRVL Rise Times vs. Load Capacitance

35

VCC = 12V
CLOAD = 3nF

TA = 25°C
VCC = 12V

DRVH

30

35
FALL TIME (ns)

30
DRVL

20
DRVH

25
15

20
0

25

50
75
100
JUNCTION TEMPERATURE (°C)

125

Figure 7. DRVH and DRVL Rise Times vs. Junction Temperature

03229-B-007

RISE TIME (ns)

DRVL

25

10
1

2

3
LOAD CAPACITANCE (nF)

4

Figure 10. DRVH and DRVL Fall Times vs. Load Capacitance

Rev. 6 | Page 7 of 13 | www.onsemi.com

ADP3418
60

5

TA = 25°C
VCC = 12V
CLOAD = 3nF

TA = 25°C
CLOAD = 3nF

20

0
0

200

400
600
800
FREQUENCY (kHz)

1000

1200

3

2

1

0
0

1

16
VCC = 12V
CLOAD = 3nF
fIN = 250kHz

14

13

12
50
75
100
JUNCTION TEMPERATURE (°C)

125

03229-B-012

SUPPLY CURRENT (mA)

15

25

4

Figure 13. DRVL Output Voltage vs. Supply Voltage

Figure 11. Supply Current vs. Frequency

0

2
3
VCC VOLTAGE (V)

Figure 12. Supply Current vs. Junction Temperature

Rev. 6 | Page 8 of 13 | www.onsemi.com

5

03229-B-013

DRVL OUTPUT VOLTAGE (V)

40

03229-B-011

SUPPLY CURRENT (mA)

4

ADP3418
THEORY OF OPERATION
The ADP3418 is a dual MOSFET driver optimized for driving
two N-channel MOSFETs in a synchronous buck converter
topology. A single PWM input signal is all that is required to
properly drive the high-side and the low-side MOSFETs. Each
driver is capable of driving a 3 nF load at speeds up to 500 kHz.
A more detailed description of the ADP3418 and its features
follows. Refer to Figure 1.

LOW-SIDE DRIVER
The low-side driver is designed to drive a ground-referenced
N-channel MOSFET. The bias to the low-side driver is internally
connected to the VCC supply and PGND.
When the driver is enabled, the driver’s output is 180° out of
phase with the PWM input. When the ADP3418 is disabled,
the low-side gate is held low.

HIGH-SIDE DRIVER
The high-side driver is designed to drive a floating N-channel
MOSFET. The bias voltage for the high-side driver is developed
by an external bootstrap supply circuit, which is connected
between the BST and SW pins.
The bootstrap circuit comprises a diode, D1, and bootstrap
capacitor, CBST1. CBST2 and RBST are included to reduce the highside gate drive voltage and limit the switch node slew rate
(referred to as a Boot-Snap™ circuit, see the Application
Information section for more details). When the ADP3418
starts up, the SW pin is at ground; therefore, the bootstrap
capacitor charges up to VCC through D1. When the PWM input
goes high, the high-side driver begins to turn on the high-side
MOSFET, Q1, by pulling charge out of CBST1 and CBST2. As Q1
turns on, the SW pin rises up to VIN, forcing the BST pin to VIN
+ VC (BST), which is enough gate-to-source voltage to hold Q1 on.
To complete the cycle, Q1 is switched off by pulling the gate
down to the voltage at the SW pin. When the low-side MOSFET,
Q2, turns on, the SW pin pulls to ground. This allows the
bootstrap capacitor to charge up to VCC again.

OVERLAP PROTECTION CIRCUIT
The overlap protection circuit prevents both of the main power
switches, Q1 and Q2, from being on at the same time. This is
done to prevent shoot-through currents from flowing through
both power switches and the associated losses that can occur
during their on/off transitions. The overlap protection circuit
accomplishes this by adaptively controlling the delay from the
Q1 turn off to the Q2 turn on, and by internally setting the
delay from the Q2 turn off to the Q1 turn on.
To prevent the overlap of the gate drives during the Q1 turn off
and the Q2 turn on, the overlap circuit monitors the voltage at
the SW pin. When the PWM input signal goes low, Q1 begins to
turn off (after propagation delay). Before Q2 can turn on, the
overlap protection circuit ensures that SW has first gone high
and then waits for the voltage at the SW pin to fall from VIN to
1 V. Once the voltage on the SW pin falls to 1 V, Q2 begins to
turn on. If the SW pin had not gone high first, the Q2 turn on is
delayed by a fixed 120 ns. By waiting for the voltage on the SW
pin to reach 1 V or for the fixed delay time, the overlap protection
circuit ensures that Q1 is off before Q2 turns on, regardless of
variations in temperature, supply voltage, input pulse width,
gate charge, and drive current. If SW does not go below 1 V
after 240 ns, DRVL turns on. This can occur if the current
flowing in the output inductor is negative and is flowing
through the high-side MOSFET body diode.
To prevent the overlap of the gate drives during the Q2 turn off
and the Q1 turn on, the overlap circuit provides an internal
delay that is set to 40 ns. When the PWM input signal goes
high, Q2 begins to turn off (after a propagation delay), but
before Q1 can turn on, the overlap protection circuit waits for
the voltage at DRVL to drop to approximately one sixth of VCC.
Once the voltage at DRVL has reached this point, the overlap
protection circuit waits for the 40 ns internal delay time. Once
the delay period has expired, Q1 turns on.

The high-side driver’s output is in phase with the PWM input.
When the driver is disabled, the high-side gate is held low.

Rev. 6 | Page 9 of 13 | www.onsemi.com

ADP3418
APPLICATION INFORMATION
SUPPLY CAPACITOR SELECTION
For the supply input (VCC) of the ADP3418, a local bypass
capacitor is recommended to reduce the noise and to supply
some of the peak currents drawn, such as a 4.7 µF, low ESR
capacitor. Multilayer ceramic chip (MLCC) capacitors provide
the best combination of low ESR and small size. Keep the
ceramic capacitor as close as possible to the ADP3418.

BOOTSTRAP CIRCUIT
The bootstrap circuit uses a charge storage capacitor (CBST) and
a diode, as shown in Figure 1. These components can be selected
after the high-side MOSFET is chosen. The bootstrap capacitor
must have a voltage rating that is able to handle twice the
maximum supply voltage. A minimum 50 V rating is
recommended. The capacitor values are determined by:
QGATE
VGATE

(1)

C BST1
VGATE
=
C BST1 + C BST2 VCC − VD

(2)

C BST1 + C BST2 = 10 ×

maximum supply voltage. The average forward current is
estimated by

I F ( AVG ) = Q GATE × f MAX

(3)

where fMAX is the maximum switching frequency of the controller. The peak surge current rating is calculated by
V − VD
I F ( PEAK ) = CC
(4)
R BST

MOSFET SELECTION
When interfacing the ADP3418 to external MOSFETs, there are
a few considerations that the designer should be aware of. These
help make a more robust design that minimizes stresses on both
the driver and MOSFETs. These stresses include exceeding the
short-time duration voltage ratings on the driver pins as well as
the external MOSFET.
It is also highly recommended to use the Boot-Snap circuit to
improve the interaction of the driver with the characteristics of
the MOSFETs. If a simple bootstrap arrangement is used, make
sure to include a proper snubber network on the SW node.

where:

HIGH-SIDE (CONTROL) MOSFETS

QGATE is the total gate charge of the high-side MOSFET at VGATE.

The high-side MOSFET is usually high speed to minimize
switching losses (see any ADI Flex-Mode™1 controller data sheet
for more details on MOSFET losses). This usually implies a low
gate resistance and a low input capacitance/charge device. Yet,
there is also a significant source lead inductance that can exist.
This depends mainly on the MOSFET package; it is best to
contact the MOSFET vendor for this information.

VGATE is the desired gate drive voltage (usually in the 5 V to 10 V
range, 7 V being typical).
VD is the voltage drop across D1.
Rearranging Equation 1 and Equation 2 to solve for CBST1 yields

C BST 1 = 10 ×

QGATE
VCC − VD

CBST2 can then be found by rearranging Equation 1 as

C BST2 = 10 ×

QGATE
− C BST1
VGATE

For example, an NTD60N02 has a total gate charge of
approximately 12 nC at VGATE = 7 V. Using VCC = 12 V and
VD = 1 V, one finds CBST1 = 12 nF and CBST2 = 6.8 nF. Good
quality ceramic capacitors should be used.
RBST is used for slew rate limiting to minimize the ringing at the
switch node. It also provides peak current limiting through D1.
An RBST value of 1.5 Ω to 2.2 Ω is a good choice. The resistor
needs to be able to handle at least 250 mW due to the peak
currents that flow through it.

The ADP3418 DRVH output impedance and the input resistance
of the MOSFETs determine the rate of charge delivery to the
gate’s internal capacitance, which determines the speed at which
the MOSFETs turn on and off. However, due to potentially large
currents flowing in the MOSFETs at the on and off times (this
current is usually larger at turn off due to ramping up of the
output current in the output inductor), the source lead inductance
generates a significant voltage across it when the high-side
MOSFETs switch off. This creates a significant drain-source
voltage spike across the internal die of the MOSFETs and can
lead to a catastrophic avalanche. The mechanisms involved in
this avalanche condition can be referenced in literature from the
MOSFET suppliers.
1

Flex-Mode is protected by U.S. Patent 6,683,441.

A small signal diode can be used for the bootstrap diode due to
the ample gate drive voltage supplied by VCC. The bootstrap
diode must have a minimum 15 V rating to withstand the

Rev. 6 | Page 10 of 13 | www.onsemi.com

ADP3418

I MAX = I DC ( per phase) + (VCC − VOUT )×

D MAX
f MAX × LOUT

(5)

where:
DMAX is determined for the VR controller being used with the
driver. Note that this current is divided roughly equally between
MOSFETs if more than one is used (assume a worst-case mismatch
of 30% for design margin).
LOUT is the output inductor value.
When producing the design, there is no exact method for
calculating the dV/dt due to the parasitic effects in the external
MOSFETs as well as the PCB. However, it can be measured to
determine if it is safe. If it appears the dV/dt is too fast, an
optional gate resistor can be added between DRVH and the
high-side MOSFETs. This resistor slows down the dV/dt, but it
also increases the switching losses in the high-side MOSFETs.
The ADP3418 has been optimally designed with internal drive
impedance that works with most MOSFETs to switch them
efficiently while minimizing dV/dt. However, some high speed
MOSFETs can require this external gate resistor, depending on
the currents being switched in the MOSFET.

LOW-SIDE (SYNCHRONOUS) MOSFETS
The low-side MOSFETs are usually selected to have a low on
resistance to minimize conduction losses. This usually implies a
large input gate capacitance and gate charge. The first concern is
to make sure the power delivery from the ADP3418’s DRVL
does not exceed the thermal rating of the driver (see any ADI
Flex-Mode controller data sheet for details).

However, during the low-side turn off to high-side turn on, the
SW pin does not contain information for determining the
proper switching time; therefore, the state of the DRVL pin is
monitored to go below one sixth of VCC and then a delay is
added. However, due to the Miller capacitance and internal
delays of the low-side MOSFET gate, one must ensure that the
Miller to input capacitance ratio is low enough, and that the
low-side MOSFET internal delays are not large enough, to allow
accidental turn on of the low-side when the high-side turns on.
A spreadsheet is available from ADI to assist designers with the
proper selection of low-side MOSFETs.

PC BOARD LAYOUT CONSIDERATIONS
Use the following general guidelines when designing printed
circuit boards:
•

Trace out the high current paths and use short, wide
(>20 mil) traces to make these connections.

•

Connect the PGND pin of the ADP3418 as close as
possible to the source of the lower MOSFET.

•

The VCC bypass capacitor should be located as close as
possible to the VCC and PGND pins.

•

Use vias to other layers when possible to maximize thermal
conduction away from the IC.

The circuit in Figure 15 shows how four drivers can be
combined with the ADP3188 to form a total power conversion
solution for generating VCC (CORE) for an Intel CPU that is VR
10.x-compliant.
Figure 14 shows an example of the typical land patterns based
on the guidelines given previously. For more detailed layout
guidelines for a complete CPU voltage regulator subsystem,
refer to the ADP3188 data sheet.
CBST1

The next concern for the low-side MOSFETs is based on
preventing them from inadvertently being switched on when
the high-side MOSFET turns on. This occurs due to the draingate (Miller, also specified as Crss) capacitance of the MOSFET.
When the drain of the low-side MOSFET is switched to VCC by
the high-side turning on (at a rate dV/dt), the internal gate of
the low-side MOSFET is pulled up by an amount roughly equal
to VCC × (Crss/Ciss). It is important to make sure this does not put
the MOSFET into conduction.

CBST2

RBST

D1

Another consideration is the nonoverlap circuitry of the
ADP3418, which attempts to minimize the nonoverlap period.
During the state of the high-side turning off to low-side turning
on, the SW pin is monitored (as well as the conditions of SW
prior to switching) to adequately prevent overlap.

CVCC

03229-B-014

The MOSFET vendor should provide a maximum voltage slew
rate at the drain current rating such that this can be designed
around. Once this specification is had, the next step is to
determine the maximum current expected to be seen in the
MOSFET. This can be done by

Figure 14. External Component Placement Example for the ADP3418 Driver
Rev. 6 | Page 11 of 13 | www.onsemi.com

Rev. 6 | Page 12 of 13 | www.onsemi.com

Figure 15. VR 10.x-Compliant Intel CPU Supply Circuit

03229-B-015

ENABLE

POWER
GOOD

C21
1nF

FROM
CPU

VIN RTN

VIN
12V

+
C1

CLDY
39nF

RLDY
470kΩ

CA
RA
RB
1.21kΩ 470pF 12.1kΩ

CB
470pF

C4
1µF

D1
1N4148

+
C2

RT
137kΩ
1%

CFB
22pF

2700MF/16V/3.3A × 2
SANYO MV-WX SERIES

C3 +
100µF

LI
370nH
18A

CSREF 16

13 RT

C23
1nF

14 RAMPADJ ILIMIT 15

CSSUM 17

12 DELAY

CSCOMP 18

GND 19

11 EN

10 PWRGD

CCS1
560pF
CCS2
1.5nF

RPH4
158kΩ, 1%

RPH2
RPH3 158kΩ,
RPH1
1% 158kΩ,
158kΩ,
1%
1%

RLIM
150kΩ
1%

C22
1nF

RCS1
RCS2
35.7kΩ 84.5kΩ

C17
4.7µF

D5
1N4148

PGND 6
DRVL 5

4 VCC

SW 7

DRVH 8

C16
6.8nF

C20
12nF

DRVL 5

PGND 6

SW 7

3 OD

2 IN

1 BST

C14
6.8nF

DRVH 8

U5
ADP3418

R6
2.2Ω

SW2 22

7 FBRTN

SW4 20

SW1 23

6 VID5

SW3 21

4 VCC

PWM4 24

5 VID0

9 COMP

3 OD

PWM3 25

8 FB

2 IN

PWM2 26

4 VID1

C13
4.7µF

1 BST

PWM1 27

3 VID2

U4
ADP3418

2 VID3

D4
1N4148

VCC 28

U1
ADP3188

C16
12nF

DRVL 5

R5
2.2Ω

PGND 6

4 VCC

SW 7

DRVH 8

C10
6.8nF

3 OD

2 IN

1 BST

U3
ADP3418

C12
12nF

DRVL 5

R4
2.2Ω

PGND 6

4 VCC

SW 7

DRVH 8

3 OD

2 IN

1 BST

1 VID4

R2
137kΩ
1%

C9
4.7µF

D3
1N4148

C5
4.7µF

D2
1N4148

C6
6.8nF

C8
12nF

U2
ADP3418

R3
2.2Ω

Q15
NTD110N02

Q11
NTD110N02

Q7
NTD110N02

Q3
NTD110N02

Q16
NTD110N02

Q13
NTD60N02

C19
4.7µF

Q12
NTD110N02

Q9
NTD60N02

C15
4.7µF

Q8
NTD110N02

Q5
NTD60N02

C11
4.7µF

Q4
NTD110N02

Q1
NTD60N02

C7
4.7µF

L5
320nH/1.4mΩ

L4
320nH/1.4mΩ

L3
320nH/1.4mΩ

RTH1
100kΩ, 5%
NTC

C24

+

+

10µF × 18
MLCC IN
SOCKET

C31

560µF/4V × 8
L4
320nH/1.4mΩ SANYO SEPC SERIES
5mΩ EACH

VCC (CORE) RTN

VCC (CORE)
0.8375 V – 1.6V
95A TDC, 119A PK

ADP3418

ADP3418
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8

5

4.00 (0.1574)
3.80 (0.1497) 1

4

1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
SEATING
0.10
PLANE

6.20 (0.2440)
5.80 (0.2284)

1.75 (0.0688)
1.35 (0.0532)

0.51 (0.0201)
0.31 (0.0122)

0.50 (0.0196)
× 45°
0.25 (0.0099)

8°
0.25 (0.0098) 0° 1.27 (0.0500)
0.40 (0.0157)
0.17 (0.0067)

COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

Figure 16. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)

ORDERING GUIDE
Model
ADP3418KRZ1
ADP3418KRZ-REEL1
1

Temperature Range
0°C to 85°C
0°C to 85°C

Package Description
8-Lead SOIC_N
8-Lead SOIC_N

Package Option
R-8
R-8

Z = Pb-free part.

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