TL331
www.ti.com ......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008

SINGLE DIFFERENTIAL COMPARATOR
FEATURES

1

•
•
•

Single Supply or Dual Supplies
Wide Range of Supply Voltage . . . 2 V to 36 V
Low Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ
Low Input Bias Current . . . 25 nA Typ
Low Input Offset Voltage . . . 2 mV Typ
Common-Mode Input Voltage Range Includes
Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±36 V
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and CMOS

•
•
•
•
•
•

DBV PACKAGE
(TOP VIEW)

IN−
VCC−/GND
IN+

1

5

VCC

4

OUT

2
3

DESCRIPTION/ORDERING INFORMATION
This device consists of a single voltage comparator that is designed to operate from a single power supply over a
wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies
is 2 V to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. The output can be connected to other open-collector outputs to achieve
wired-AND relationships.
ORDERING INFORMATION (1)
TA

VIO(max)
AT 25°C

–40°C to 85°C

5 mV

SOT-23 – DBV

–40°C to 105°C

5 mV

SOT-23 – DBV

(1)
(2)
(3)

PACKAGE (2)

ORDERABLE PART NUMBER

Reel of 3000

TL331IDBVR

Reel of 250

TL331IDBVT

Reel of 3000

TL331KDBVR

Reel of 250

TL331KDBVT

TOP-SIDE MARKING (3)
T1I_
T1K_

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright © 1999–2008, Texas Instruments Incorporated

TL331
SLVS238F – AUGUST 1999 – REVISED JULY 2008 ......................................................................................................................................................... www.ti.com

LOGIC DIAGRAM
IN+

OUT

IN−

SCHEMATIC
VCC
80-µA
Current Regulator

10 µA

60 µA

10 µA

80 µA

IN+

COMPONENT COUNT

OUT

Epi-FET
Diodes
Resistors
Transistors

1
2
1
20

IN−

GND

Note:

Current values shown are nominal.

ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC

Supply voltage (2)

36 V

VID

Differential input voltage (3)

±36 V

VI

Input voltage range (either input)

VO

Output voltage

36 V

IO

Output current

20 mA

–0.3 V to 36 V

Duration of output short-circuit to ground (4)
θJA

Package thermal impedance

TJ

Operating virtual junction temperature

Tstg

Storage temperature range

(1)
(2)
(3)
(4)
(5)
(6)

2

Unlimited

(5) (6)

206°C/W
150°C
–65°C to 150°C

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.

Submit Documentation Feedback

Copyright © 1999–2008, Texas Instruments Incorporated

Product Folder Link(s): TL331

TL331
www.ti.com ......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008

ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER

TEST CONDITIONS (1)

TA (2)
25°C

VIO

Input offset voltage

VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)

IIO

Input offset current

VO = 1.4 V

IIB

Input bias current

VO = 1.4 V

VICR

Common-mode input voltage
range (3)

AVD

Large-signal differential voltage
amplification

IOH

High-level output current

TYP

MAX

2

5

Full range

9

25°C

5

Full range
–25

Full range

VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC

0 to
VCC – 1.5

Full range

0 to
VCC – 1.5
50

VOH = 5 V, VID = 1 V

25°C

VOH = 30 V, VID = 1 V

Full range

IOL = 4 mA, VID = –1 V

IOL

Low-level output current

VOL = 1.5 V, VID = 1 V

25°C

ICC

Supply current

RL = ∞, VCC = 5 V

25°C

UNIT
mV
nA
nA

V

200

V/mV

0.1

25°C

Low-level output voltage

–250
–400

25°C

25°C

50
250

25°C

VOL

(1)
(2)
(3)

MIN

150

Full range

50

nA

1

µA

400
700

6

mV
mA

0.4

0.7

mA

All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
Full range TA is –40°C to 85°C for I-suffix devices and –40°C to 105°C for K-suffix devices.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the
common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.

SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
Response time
(1)
(2)

TEST CONDITIONS
RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1) (2)

TYP

100-mV input step with 5-mV overdrive

1.3

TTL-level input step

0.3

UNIT
µs

CL includes probe and jig capacitance.
The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.

Submit Documentation Feedback

Copyright © 1999–2008, Texas Instruments Incorporated

Product Folder Link(s): TL331

3

PACKAGE OPTION ADDENDUM

www.ti.com

26-Mar-2013

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (°C)

(3)

Top-Side Markings
(4)

TL331IDBVR

ACTIVE

SOT-23

DBV

5

3000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IS)

TL331IDBVRE4

ACTIVE

SOT-23

DBV

5

3000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IS)

TL331IDBVRG4

ACTIVE

SOT-23

DBV

5

3000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IS)

TL331IDBVT

ACTIVE

SOT-23

DBV

5

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IU)

TL331IDBVTE4

ACTIVE

SOT-23

DBV

5

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IU)

TL331IDBVTG4

ACTIVE

SOT-23

DBV

5

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

(T1I3 ~ T1IG ~
T1IL ~ T1IU)

TL331KDBVR

ACTIVE

SOT-23

DBV

5

3000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

(T1KG ~ T1KL)

TL331KDBVRG4

ACTIVE

SOT-23

DBV

5

3000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

(T1KG ~ T1KL)

TL331KDBVT

ACTIVE

SOT-23

DBV

5

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

(T1KG ~ T1KL)

TL331KDBVTG4

ACTIVE

SOT-23

DBV

5

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

(T1KG ~ T1KL)

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

26-Mar-2013

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331 :

• Automotive: TL331-Q1
NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

26-Jan-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

TL331IDBVR

SOT-23

DBV

5

3000

178.0

9.0

TL331IDBVR

SOT-23

DBV

5

3000

180.0

TL331IDBVT

SOT-23

DBV

5

250

180.0

TL331KDBVR

SOT-23

DBV

5

3000

TL331KDBVR

SOT-23

DBV

5

3000

3.23

3.17

1.37

4.0

8.0

Q3

9.2

3.17

3.23

1.37

4.0

8.0

Q3

9.2

3.17

3.23

1.37

4.0

8.0

Q3

178.0

9.0

3.23

3.17

1.37

4.0

8.0

Q3

180.0

9.2

3.17

3.23

1.37

4.0

8.0

Q3

Pack Materials-Page 1

W
Pin1
(mm) Quadrant

PACKAGE MATERIALS INFORMATION
www.ti.com

26-Jan-2013

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

TL331IDBVR

SOT-23

DBV

5

3000

180.0

180.0

18.0

TL331IDBVR

SOT-23

DBV

5

3000

205.0

200.0

33.0

TL331IDBVT

SOT-23

DBV

5

250

205.0

200.0

33.0

TL331KDBVR

SOT-23

DBV

5

3000

180.0

180.0

18.0

TL331KDBVR

SOT-23

DBV

5

3000

205.0

200.0

33.0

Pack Materials-Page 2

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