Surface Mount RF Schottky
Barrier Diodes
Technical Data
HSMS-280x Series

Features
• Surface Mount Packages
• High Breakdown Voltage
• Low FIT (Failure in Time)
Rate*
• Six-sigma Quality Level
• Single, Dual and Quad
Versions
• Tape and Reel Options
Available

Package Lead Code Identification, SOT-23/SOT-143
(Top View)
SINGLE
3

SERIES
3

1

1

#0

2

UNCONNECTED
PAIR
3
4

#2

2

RING
QUAD
3
4

COMMON
ANODE
3

1

#3

COMMON
CATHODE
3

2

1

#4

2

BRIDGE
QUAD
3
4

• Lead-free Option Available
* For more information see the
Surface Mount Schottky Reliability
Data Sheet.

Description/Applications
These Schottky diodes are
specifically designed for both
analog and digital applications.
This series offers a wide range of
specifications and package
configurations to give the
designer wide flexibility. The
HSMS-280x series of diodes is
optimized for high voltage
applications.
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.

1

#5

2

1

#7

2

Package Lead Code
Identification, SOT-323
(Top View)
SINGLE

B
COMMON
ANODE

E

SERIES

C
COMMON
CATHODE

1

#8

2

Package Lead Code
Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED PAIR
6

5

1

2

4

6

5

3

1

2

K

5

1

2

4

3

L

COMMON
CATHODE QUAD
6

UNCONNECTED
TRIO

4

COMMON
ANODE QUAD
6

5

1

2

4

F
M

3

BRIDGE
QUAD
6

5

1

2

P

4

6

3

1

N

3

RING
QUAD
5

2

4

R

3

2

Pin Connections and Package Marking, SOT-363

GUx

1
2
3

6
5
4

Notes:
1. Package marking provides
orientation and identification.
2. See “Electrical Specifications” for
appropriate package marking.

ESD WARNING:
Handling Precautions Should Be Taken
To Avoid Static Discharge.

Absolute Maximum Ratings[1] TC = 25°C
Symbol
If
PIV
Tj
Tstg
θjc

Parameter

Unit

SOT-23/SOT-143

SOT-323/SOT-363

Forward Current (1 µs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]

Amp
V
°C
°C
°C/W

1
Same as VBR
150
-65 to 150
500

1
Same as VBR
150
-65 to 150
150

Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.

Electrical Specifications TA = 25°C, Single Diode[4]
Part
Package
Number Marking Lead
HSMS[5]
Code
Code
2800
2802
2803
2804
2805
2807
2808
280B
280C
280E
280F
280K

A0[3]
A2[3]
A3[3]
A4[3]
A5[3]
A7[3]
A8[3]
A0[7]
A2[7]
A3[7]
A4[7]
AK[7]

0
2
3
4
5
7
8
B
C
E
F
K

280L
280M
280N
280P
280R

AL[7]
H[7]
N[7]
AP[7]
O[7]

L
M
N
P
R

Test Conditions

Configuration
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Ring Quad[5]
Bridge Quad[5]
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
Ring Quad

Minimum Maximum
Breakdown Forward
Voltage
Voltage
VBR (V)
VF (mV)
70

410

IR = 10 µA

IF = 1 mA

Maximum
Forward
Voltage
VF (V) @
IF (mA)
1.0

15

Maximum
Reverse
Typical
Leakage
Maximum
Dynamic
IR (nA) @ Capacitance Resistance
Ω) [6]
VR (V)
CT (pF)
RD (Ω
200

50

2.0

35

VF = 0 V
f = 1 MHz

IF = 5 mA

Notes:
1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.
3. Package marking code is in white.
4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
5. See section titled “Quad Capacitance.”
6. R D = R S + 5.2 Ω at 25°C and I f = 5 mA.
7. Package marking code is laser marked.

3

Quad Capacitance
Capacitance of Schottky diode
quads is measured using an
HP4271 LCR meter. This
instrument effectively isolates
individual diode branches from
the others, allowing accurate
capacitance measurement of each
branch or each diode. The
conditions are: 20 mV R.M.S.
voltage at 1 MHz. Agilent defines
this measurement as “CM”, and it
is equivalent to the capacitance of
the diode by itself. The equivalent
diagonal and adjacent
capacitances can then be
calculated by the formulas given
below.

1
CADJACENT = C1 + ____________
1
1
1
–– + –– + ––
C2 C 3 C4

C1 x C2
C3 x C4
CDIAGONAL = _______
+ _______
C1 + C2
C3 + C4
A
C1

C3

C2

C4

This information does not apply
to cross-over quad diodes.

C

Linear Equivalent Circuit, Diode Chip
Rj
RS

Cj

RS = series resistance (see Table of SPICE parameters)
C j = junction capacitance (see Table of SPICE parameters)
Rj =

The equivalent adjacent
capacitance is the capacitance
between points A and C in the
figure below. This capacitance is
calculated using the following
formula

In a quad, the diagonal capacitance is the capacitance between
points A and B as shown in the
figure below. The diagonal
capacitance is calculated using
the following formula

8.33 X 10-5 nT
Ib + Is

where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.

B

SPICE Parameters
Parameter Units
BV
CJ0
EG
IBV
IS
N
RS
PB
PT
M

V
pF
eV
A
A
Ω
V

HSMS-280x
75
1.6
0.69
E-5
3E - 8
1.08
30
0.65
2
0.5

4

Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
1000

10,000

10

1

TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
0

1000

100

TA = +125°C
TA = +75°C
TA = +25°C

10
1

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

0

VF – FORWARD VOLTAGE (V)

10

20

30

40

30

IF - FORWARD CURRENT (mA)

1.5

1

0.5

0
0

10

20

30

40

VR – REVERSE VOLTAGE (V)

Figure 4. Total Capacitance vs.
Reverse Voltage.

50

30

IF (Left Scale)

10

10

∆VF (Right Scale)
1

0.3
0.2

1

0.4

0.6

0.8

1.0

1.2

1

10

Figure 3. Dynamic Resistance vs.
Forward Current.

Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.

2

10

I F – FORWARD CURRENT (mA)

VR – REVERSE VOLTAGE (V)

Figure 1. Forward Current vs.
Forward Voltage at Temperatures.

100

1
0.1

50

0.3
1.4

VF - FORWARD VOLTAGE (V)

Figure 5. Typical Vf Match, Pairs and
Quads.

∆VF - FORWARD VOLTAGE DIFFERENCE (mV)

0.1

0.01

C T – CAPACITANCE (pF)

RD – DYNAMIC RESISTANCE (Ω)

100,000

I R – REVERSE CURRENT (nA)

I F – FORWARD CURRENT (mA)

100

100

5

Applications Information
Introduction —
Product Selection
Agilent’s family of Schottky
products provides unique solutions to many design problems.
The first step in choosing the right
product is to select the diode type.
All of the products in the
HSMS-280x family use the same
diode chip, and the same is true of
the HSMS-281x and HSMS-282x
families. Each family has a
different set of characteristics
which can be compared most
easily by consulting the SPICE
parameters in Table 1.
A review of these data shows that
the HSMS-280x family has the
highest breakdown voltage, but at
the expense of a high value of
series resistance (Rs). In applications which do not require high
voltage the HSMS-282x family,
with a lower value of series

resistance, will offer higher
current carrying capacity and
better performance. The HSMS281x family is a hybrid Schottky
(as is the HSMS-280x), offering
lower 1/f or flicker noise than the
HSMS-282x family.
In general, the HSMS-282x family
should be the designer’s first
choice, with the -280x family
reserved for high voltage applications and the HSMS-281x family
for low flicker noise applications.

Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 6
(dimensions are in inches). This
layout provides ample allowance
for package placement by automated assembly equipment
without adding parasitics that
could impair the performance.

0.026

0.07
0.035

0.016

Figure 6. PCB Pad Layout
(dimensions in inches).

Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70,
6 lead) package is shown in
Figure 7 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assembly
equipment without adding
parasitics that could impair the
performance.
0.026

Table 1. Typical SPICE Parameters.

Parameter

Units

HSMS-280x

HSMS-281x

HSMS-282x

BV
CJ0
EG
IBV
IS
N
RS
PB (VJ)
PT (XTI)
M

V
pF
eV
A
A

75
1.6
0.69
1 E-5
3 E-8
1.08
30
0.65
2
0.5

25
1.1
0.69
1 E-5
4.8 E-9
1.08
10
0.65
2
0.5

15
0.7
0.69
1 E-4
2.2 E-8
1.08
6.0
0.65
2
0.5

0.075

Ω
V

0.035

0.016

Figure 7. PCB Pad Layout
(dimensions in inches).

6

After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.

SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.

The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low
enough to not cause deformation
of the board or damage to components due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235°C.

Agilent’s SOT diodes have been
qualified to the time-temperature
profile shown in Figure 8. This
profile is representative of an IR
reflow type of surface mount
assembly process.

250
TMAX
TEMPERATURE (°C)

200

150
Reflow
Zone
100
Preheat
Zone

Cool Down
Zone

50
0
0

60

120

180

TIME (seconds)
Figure 8. Surface Mount Assembly Profile.

240

300

These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures and times necessary to
achieve a uniform reflow of
solder.

7

Part Number Ordering Information
Part Number
HSMS-280x-TR2*

No. of
Devices
10000

Container
13" Reel

HSMS-280x-TR1*
HSMS-280x-BLK *

3000
100

7" Reel
antistatic bag

x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L, M, N, P, R
For lead-free option, the part number will have the
character "G" at the end, eg. HSMS-280x-TR2G for a
10,000 lead-free reel.

Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)

Outline SOT-323 (SC-70 3 Lead)

0.54 (0.021)
0.37 (0.015)

PACKAGE
MARKING
CODE (XX)

DATE CODE (X)

PACKAGE
MARKING
CODE (XX)

1.30 (0.051)
REF.

2.20 (0.087)
2.00 (0.079)

XXX

DATE CODE (X)

3
1.40 (0.055)
1.20 (0.047)

XXX

2.65 (0.104)
2.10 (0.083)

1.35 (0.053)
1.15 (0.045)

2

1

0.650 BSC (0.025)

0.60 (0.024)
0.45 (0.018)

2.04 (0.080)
1.78 (0.070)

0.425 (0.017)
TYP.

2.20 (0.087)
1.80 (0.071)

TOP VIEW
0.10 (0.004)
0.00 (0.00)

0.152 (0.006)
0.066 (0.003)

3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)

0.30 REF.

1.00 (0.039)
0.80 (0.031)

0.25 (0.010)
0.15 (0.006)

10°

0.30 (0.012)
0.10 (0.004)

0.20 (0.008)
0.10 (0.004)

0.69 (0.027)
0.45 (0.018)

0.10 (0.004)
0.013 (0.0005)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

SIDE VIEW

END VIEW

DIMENSIONS ARE IN MILLIMETERS (INCHES)

Outline 143 (SOT-143)

Outline SOT-363 (SC-70 6 Lead)

0.92 (0.036)
0.78 (0.031)
DATE CODE (X)
2

PACKAGE
MARKING
CODE (XX)

1.30 (0.051)
REF.

2.20 (0.087)
2.00 (0.079)

XXX

DATE CODE (X)

1

PACKAGE
MARKING
CODE (XX)

1.40 (0.055)
1.20 (0.047)

XXX

4

2.65 (0.104)
2.10 (0.083)

1.35 (0.053)
1.15 (0.045)

3
0.60 (0.024)
0.45 (0.018)

2.04 (0.080)
1.78 (0.070)

0.650 BSC (0.025)

0.54 (0.021)
0.37 (0.015)

3.06 (0.120)
2.80 (0.110)

0.425 (0.017)
TYP.

2.20 (0.087)
1.80 (0.071)
0.15 (0.006)
0.09 (0.003)

0.10 (0.004)
0.00 (0.00)

0.30 REF.

1.04 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)

0.69 (0.027)
0.45 (0.018)

1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)

10°

0.30 (0.012)
0.10 (0.004)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

0.20 (0.008)
0.10 (0.004)

8

Device Orientation

For Outlines SOT-23, -323

REEL

TOP VIEW

END VIEW

4 mm

CARRIER
TAPE

8 mm

USER
FEED
DIRECTION

ABC

For Outline SOT-143
TOP VIEW

ABC

ABC

For Outline SOT-363
END VIEW

TOP VIEW

4 mm

ABC

ABC

Note: "AB" represents package marking code.
"C" represents date code.

COVER TAPE

8 mm

ABC

END VIEW

4 mm

ABC

ABC

Note: "AB" represents package marking code.
"C" represents date code.

8 mm

ABC

ABC

ABC

ABC

Note: "AB" represents package marking code.
"C" represents date code.

9

Tape Dimensions and Product Orientation
For Outline SOT-23
P

P2

D

E

P0

F
W

D1

t1

Ko

9° MAX

13.5° MAX

8° MAX

B0

A0

DESCRIPTION

SYMBOL

SIZE (mm)

SIZE (INCHES)

CAVITY

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A0
B0
K0
P
D1

3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05

0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002

PERFORATION

DIAMETER
PITCH
POSITION

D
P0
E

1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10

0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004

CARRIER TAPE

WIDTH
THICKNESS

W
t1

8.00 +0.30 –0.10
0.229 ± 0.013

0.315 +0.012 –0.004
0.009 ± 0.0005

DISTANCE
BETWEEN
CENTERLINE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

F

3.50 ± 0.05

0.138 ± 0.002

CAVITY TO PERFORATION
(LENGTH DIRECTION)

P2

2.00 ± 0.05

0.079 ± 0.002

For Outline SOT-143
P

D
P2

P0

E
F

W

D1
t1

K0

9° MAX

9° MAX

A0

B0

DESCRIPTION

SYMBOL

SIZE (mm)

SIZE (INCHES)

CAVITY

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A0
B0
K0
P
D1

3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
4.00 ± 0.10
1.00 + 0.25

0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.157 ± 0.004
0.039 + 0.010

PERFORATION

DIAMETER
PITCH
POSITION

D
P0
E

1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10

0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004

CARRIER TAPE

WIDTH
THICKNESS

W
t1

8.00 +0.30 –0.10
0.254 ± 0.013

0.315+0.012 –0.004
0.0100 ± 0.0005

DISTANCE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

F

3.50 ± 0.05

0.138 ± 0.002

CAVITY TO PERFORATION
(LENGTH DIRECTION)

P2

2.00 ± 0.05

0.079 ± 0.002

Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P

P2

D
P0

E

F
W
C

D1
t1 (CARRIER TAPE THICKNESS)

Tt (COVER TAPE THICKNESS)

K0

An

A0

DESCRIPTION

B0

SYMBOL

SIZE (mm)

SIZE (INCHES)

CAVITY

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A0
B0
K0
P
D1

2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ± 0.10
1.00 + 0.25

0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010

PERFORATION

DIAMETER
PITCH
POSITION

D
P0
E

1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10

0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004

CARRIER TAPE

WIDTH
THICKNESS

W
t1

8.00 ± 0.30
0.254 ± 0.02

0.315 ± 0.012
0.0100 ± 0.0008

COVER TAPE

WIDTH
TAPE THICKNESS

C
Tt

5.4 ± 0.10
0.062 ± 0.001

0.205 ± 0.004
0.0025 ± 0.00004

DISTANCE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

F

3.50 ± 0.05

0.138 ± 0.002

CAVITY TO PERFORATION
(LENGTH DIRECTION)

P2

2.00 ± 0.05

0.079 ± 0.002

FOR SOT-323 (SC70-3 LEAD)

An

8°C MAX

ANGLE

FOR SOT-363 (SC70-6 LEAD)

An

10°C MAX

www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(916) 788-6763
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5968-7960E
March 24, 2004
5989-0474EN

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